Computer heat sink processing refers to the main way in which the heat sink dissipates heat. In thermodynamics, heat dissipation is heat transfer, and there are three main ways of transferring heat:

Heat conduction, heat convection and heat radiation. When the substance itself or when the substance comes into contact with the substance, the transfer of energy is called heat conduction, which is a more common form of heat transfer. For example, the way in which the CPU heat sink base is in direct contact with the CPU to remove heat is heat conduction. Heat convection refers to the heat transfer mode of the flowing fluid (gas or liquid) to the tropics. In the heat dissipation system of the computer case, the "forced heat convection" heat dissipation method that drives the gas flow is more common. Thermal radiation refers to the transfer of heat by means of ray radiation. The more common day is solar radiation. These three heat dissipation methods are not isolated. In the daily heat transfer, these three heat dissipation methods are simultaneous and work together.

In fact, any type of heat sink basically uses the above three heat transfer methods at the same time, but the focus is different. For example, an ordinary CPU air-cooled heat sink, CPU computer heat sink processing and direct contact with the CPU surface, the heat of the CPU surface is transferred to the CPU heat sink through heat conduction; the heat dissipation fan generates airflow to take away the heat of the CPU computer heat sink processing surface through heat convection. The air flow in the chassis is also carried away by heat convection to the heat of the surrounding air of the CPU computer heat sink, until the outside of the chassis; at the same time, all the high temperature parts will radiate heat to the low temperature part.

The heat dissipation efficiency of the heat sink is related to the thermal conductivity of the heat sink material, the heat capacity of the heat sink material and the heat sink medium, and the effective heat dissipation area of ​​the heat sink.

According to the way to remove heat from the heat sink, the heat sink can be divided into active heat dissipation and passive heat dissipation. The former is usually an air-cooled heat sink, while the latter is commonly used as a heat sink. Further subdivided heat dissipation methods can be divided into air cooling, heat pipe, liquid cooling, semiconductor refrigeration, compressor refrigeration and so on.

Air-cooled heat dissipation is more common and very simple, using a fan to remove the heat absorbed by the heat sink. It has the advantages of relatively low price and simple installation, but it is highly dependent on the environment. For example, when the temperature rises and overclocking, its heat dissipation performance will be greatly affected.

The heat pipe is a heat transfer element with extremely high thermal conductivity. It transfers heat by evaporation and condensation of liquid in a fully enclosed vacuum tube. It uses a fluid principle such as capillary action to function as a refrigerator compressor. Effect. It has extremely high thermal conductivity, good isothermality, heat transfer area on both sides of cold and heat, arbitrarily changeable, long-distance heat transfer, temperature control, etc., and heat exchangers composed of heat pipes have heat transfer efficiency. High, compact structure, small fluid resistance and other advantages. Due to its special heat transfer characteristics, it can control the wall temperature and avoid dew point corrosion.

Liquid cooling is the use of liquid to force the circulation of the radiator away from the pump. It has the advantages of quietness, stable temperature stability and low dependence on the environment compared with air cooling. However, the price of heat pipes and liquid cooling is relatively high, and the installation is relatively troublesome.

When you purchase a radiator, you can purchase it according to your actual needs and economic conditions. The principle is enough. - Circuit breaker energy storage motor

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